0
Broadband

AppliedMicro, TE team up on connectivity for data centre

Monday 23 March 2015 | 15:02 CET | News
Applied Micro Circuits and TE Connectivity partnered to develop high-speed cable connectivity products for data centre networks. The collaboration will result in active copper cables for connecting servers to top-of-rack (TOR) switches at 50Gbps and 40Gbps speeds using AppliedMicro's DSP-based transceiver and TE Connectivity's high-speed copper cable assemblies. AppliedMicro and TE Connectivity will showcase their high-speed cable connectivity products at OFC in Los Angeles.

Thank you for visiting Telecompaper

Sign up below to get access to the rest of this article and all the telecom news you need.

  • Register free and gain access to even more articles from Telecompaper. Register here
  • Subscribe and get unlimited access to Telecompaper’s full coverage, with a customised choice of news, commentary, research and alerts.

Subscriptions

Already registered?



Categories: Fixed
Companies: AppliedMicro / TE Connectivity
Countries: World
::: add a comment

Add comment

Please login or register to leave a comment.

We welcome comments that add value to the discussion. We attempt to block comments that use offensive language or appear to be spam, and our editors frequently review the comments to ensure they are appropriate. If you see a comment that you believe is inappropriate to the discussion, you can bring it to our attention by using the report abuse links. As the comments are written and submitted by visitors of the Telecompaper website, they in no way represent the opinion of Telecompaper.


Related

AppliedMicro, China Unicom Labs partner on testing programme

Published 02 Nov 2015 16:27 CET | China
Applied Micro Circuits and China Unicom Labs announced a joint testing verification programme intended to reduce data centre ...

AppliedMicro, HP power Utah University's CloudLab facility

Published 28 Apr 2015 15:42 CET | World
Applied Micro Circuits and HP entered into a collaboration to power the CloudLab facility at the University of Utah, an academic ...

CommScope installs ION-E indoor wireless system in TI office

Published 27 Feb 2015 09:44 CET | Italy
Global connectivity infrastructure provider CommScope has announced that its ION-E unified wireless infrastructure has been ...

TE Connectivity prices senior notes offering of EUR 550 mln

Published 25 Feb 2015 13:48 CET | World
TE Connectivity said unit Tyco Electronics has priced an offering of EUR 550 million worth of senior notes (1.100%) due 2023. The ...

TE to focus on connectivity, sensor markets after strong Q1

Published 28 Jan 2015 16:25 CET | World
TE Connectivity wants to put its full attention on expanding its leadership position in the connectivity and sensor markets, with ...

Commscope buys TE Connectivity businesses for USD 3 bln

Published 28 Jan 2015 14:45 CET | World
CommScope has agreed to acquire TE Connectivity's Telecom, Enterprise and Wireless operations for USD 3 billion in cash. The ...

AppliedMicro samples HeliX 2 embedded processor products

Published 27 Jan 2015 17:58 CET | World
Applied Micro Circuits announced the sampling of its 28-nanometer HeliX 2 embedded processor system-on-a-chip products. The 28nm ...

AppliedMicro unveils X-Weave connectivity products

Published 25 Jul 2013 08:43 CET | World
Fabless semiconductor company Applied Micro Circuits has introduced X-Weave family of connectivity products for public cloud, ...