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Wireless

FiRa Consortium created to promote ultra-wideband wireless technology

Thursday 1 August 2019 | 15:15 CET | News
The Assa Abloy Group, HID Global, NXP Semiconductors, Samsung Electronics, and Bosch announced the launch of the FiRa Consortium. The new coalition is designed to grow the ultra-wideband (UWB) ecosystem so new use cases for fine ranging functionalities can thrive, ultimately setting a new standard in seamless user experiences. Sony Imaging Products & Solutions, LitePoint and the Telecommunications Technology Association (TTA) are the first companies to join the newly-formed organisation.

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Categories: Mobile & Wireless
Companies: Bosch / NXP Semiconductors / Samsung / Sony
Countries: World
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