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Wireless

Infineon ships industrial-grade eSIM in miniaturised package

Wednesday 12 December 2018 | 10:43 CET | News
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Infineon Technologies provides what it calls the world's first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). The product allows manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers to optimise the design of their IoT devices.

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Categories: Mobile & Wireless
Companies: GSMA / Infineon
Countries: World
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