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Intel advances hardware, cloud and connectivity at Open Compute Project Global Summit

Friday 15 March 2019 | 12:55 CET | News

Intel announced new open hardware advancements at the Open Compute Project (OCP) Global Summit. These are meant to enable greater computing functionalities, innovation and cost efficiencies for data centre hardware developers. The new advancements include a high-density, cloud-optimised reference design; collaboration with Facebook on the upcoming Intel Cooper Lake processor family, as well as optimisation on Intel’s Rack Scale Design.

The announcements will enable greater flexibility, customisation and efficiency for the OCP community. Intel’s engineering expertise will help drive the future of computing and will provide the products and technologies that are the foundation for innovation.

New high-density, cloud-optimised reference design for Intel processors

A new cloud-optimised, 4-socket reference design offered for Intel Xeon Scalable processors will increase core count up to 112 in a single 2U platform, increase memory bandwidth and provide potential double-digit total cost of ownership savings. Designed for cloud IaaS, Bare Metal and function-as-a service products, this new design is jointly contributed to OCP by Intel and Inspur, as an Open Accepted Certified submittal. Dell, HP, Hyve Solutions, Lenovo, Quanta, Supermicro, Wiwynn and ZT Systems are expected to provide products based on this reference design in 2019.

Intel will contribute its RSD 2.3 Rack Management Module code to the newly formed OCP-based community, OpenRMC. The company will also release a complete family of OCPv3.0-complaint network interface controllers (NIC) ranging from 1GbE to 100GbE (1, 10, 25, 50, 100) starting in 2019’s third quarter.



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Categories: Fixed / IT
Companies: Facebook / Intel / Lenovo / Quanta
Countries: World
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