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General

Telefonica issues USD 1.25 bln in 30-year bonds

Wednesday 27 February 2019 | 10:40 CET | News
Telefonica has announced the issue of a total of USD 1.25 billion in 30-year bonds as part of its US Debt Registered Programme. In a statement to Spanish market regulator CNMV, Telefonica said demand for the issue exceeded USD 3 billion and is due on 01 March 2049, with a coupon of 5.52 percent.

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Categories: General
Companies: Telefonica
Countries: Spain
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