Ventev introduces three new Wi-Fi antennas

Monday 7 April 2014 | 17:11 CET | News
Ventev Wireless Infrastructure, a division of Tessco Technologies, has unveiled three new antenna products to expand the TerraWave portfolio of high-density offerings that address the challenges of Wi-Fi deployments in large venues with many simultaneous users. The 4 dBi high-density patch antenna is suited for facilities with lower ceilings and multi-levels like classrooms and lecture halls, where there is more floor-to-floor interference. The lower gain of the TeraWave 4 dBi Antenna limits RF interference. The 6 dBi high-density path antenna complements the portfolio of 6dBi TeraWave

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Categories: Mobile & Wireless
Companies: Tessco Technologies
Countries: United States
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