Japanese operator NTT Docomo and equipment makers NEC, Panasonic Mobile Communications and Fujitsu have jointly developed software and hardware for a single large-scale integration (LSI) chip that will enable small modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards. Performance evaluation of the LSI engineering sample chip was completed previously, and all testing required to confirm interconnectivity to the mobile networks of major vendors has also been completed. The development means that modems in future mobile devices will require one chip, in order to operate on multiple mobile standards. The four partners, in addition to other major players in the mobile technology field, working through a joint venture currently being planned, aim to commercialise the chip in Japan and other countries as quickly as possible in response to market demands for smaller mobile devices. The group additionally plans to pursue development of a multi-standard chip that is compliant with the LTE-Advanced enhanced transmission standard.
