Vsora inks partnership with Scaleway, ZML and Paris region on sovereign AI workload
FRANCE 19 JUN

Vsora inks partnership with Scaleway, ZML and Paris region on sovereign AI workload

Paris-based fabless semiconductor company Vsora announced a strategic collaboration with Iliad cloud subsidiary Scaleway, AI inference expert ZML, and the local authority of Ile-de-France, the region surrounding Paris. With this joint initiative, the partners are backing the launch of a sovereign offering based on Vsora's Jotunn8 processor, designed for large-scale AI inference workloads in data centres. Endorsed by the European Innovation Council (EIC), Jotunn8 has now reached the manufacturing stage.

SK Hynix ships 12-layer HBM4E samples to customers
GLOBAL 18 JUN

SK Hynix ships 12-layer HBM4E samples to customers

SK Hynix has shipped samples of its 12-layer HBM4E high-bandwidth memory product to major customers, marking the latest step in the development of next-generation memory technology for AI infrastructure. The company said the HBM4E samples were delivered on schedule and that it is working with partners to prepare for mass production. HBM4E is designed for AI training and inference workloads and offers a maximum data transfer speed of 16 Gbps per pin. According to SK Hynix, the product delivers more than 20 p

Qualcomm intros smart glasses development platform and new XR SoC chipset
GLOBAL 17 JUN

Qualcomm intros smart glasses development platform and new XR SoC chipset

Qualcomm is launching a Snapdragon-branded ecosystem tailored to makers of personal AI devices such as smart glasses, and is also preparing the release of latest XR system-on-chip (SoC) catered to next-generation spatial computing. Snapdragon START pairs Qualcomm's silicon and connectivity modules with an AI-agnostic software stack and third-party tooling partnerships. This ecosystem-led template will focus on smart glasses to begin with, before branching out into additional personal AI devices later this y

IQE and Tower sign multi-year InP wafer supply agreement for AI data centre optics
UNITED KINGDOM 16 JUN

IQE and Tower sign multi-year InP wafer supply agreement for AI data centre optics

UK-based chip wafer supplier IQE and Tower Semiconductor have signed a multi-year agreement covering the supply of indium phosphide (InP) epiwafers for optical connectivity technologies used in AI-driven data centre infrastructure. Under the agreement, IQE will supply InP epiwafers for use in several of Tower Semiconductor's silicon photonics platforms. The companies said the collaboration will support the development and production of optical technologies including 200Gb/s-per-lane pluggable transceivers,

Sharon AI expands Vast Data partnership with planned 600PB AI storage deployment
AUSTRALIA 16 JUN

Sharon AI expands Vast Data partnership with planned 600PB AI storage deployment

Australian cloud infrastructure provider Sharon AI has expanded its partnership with Vast Data, committing to deploy 600 PB of the Vast AI Operating System across its AI cloud infrastructure. The companies said the platform will serve government, enterprise, research and AI-focused customers across Australia and the Asia-Pacific region, forming the data layer for Sharon AI's sovereign AI infrastructure.

Korea ICT exports hit record high in May on semiconductor demand
KOREA, REPUBLIC OF 15 JUN

Korea ICT exports hit record high in May on semiconductor demand

South Korea's information and communications technology (ICT) exports reached a record USD 47.79 billion in May, driven by strong semiconductor demand linked to AI infrastructure investment, according to data released by the ministry of science and ICT and the ministry of trade, industry and energy. ICT exports increased 128.9 percent year-on-year, while imports rose 36 percent to USD 15.7 billion. The resulting trade surplus reached a record USD 32.09 billion.

Ensilica progresses edge AI ASIC project after completing design phase and testing
GLOBAL 11 JUN

Ensilica progresses edge AI ASIC project after completing design phase and testing

EnSilica revealed it has completed the production tape-out on a contract awarded in July 2024 for edge AI-targeted ASIC chips. The milestone means EnSilica will collect USD 5 million in non-recurring engineering (NRE) revenue and tape-out fees, which will be recognised in its FY26/FY27 statements.

Qorvo to launch defence X-band radar front-end module
GLOBAL 11 JUN

Qorvo to launch defence X-band radar front-end module

Qorvo said it is sampling a new X-band radar front-end module that helps defence OEMs to integrate modern phased arrays for RF sensing without increasing real estate or prime power. The Qorvo QPF5012 acts as a fully integrated X-band transmit/receive front-end module operating at 8.5-10.5 GHz frequencies and 10-watt transmit power. The module is contained in a 7 by 5 millimetre package. 

Netherlands expands Deep Tech Fund to EUR 610 mln
NETHERLANDS 11 JUN

Netherlands expands Deep Tech Fund to EUR 610 mln

The Dutch Ministry of Economic Affairs and Climate Policy and state financing institution Invest-NL have announced a combined EUR 360 million top-up to the Deep Tech Fund (DTF), bringing its total size to EUR 610 million. The DTF targets knowledge-intensive startups and scale-ups active in fields such as photonics, semiconductors, artificial intelligence, quantum technology, and nanotechnology — sectors where long development cycles and high technical risk often make private financing difficult to secure.

Nvidia adjusts Vera CPU design to address memory supply shortfalls - TrendForce
GLOBAL 11 JUN

Nvidia adjusts Vera CPU design to address memory supply shortfalls - TrendForce

Nvidia has reduced the SOCAMM memory capacity of its next-generation Vera Rubin Superchip modules in response to anticipated constraints in low-power DRAM (LPDRAM) supply, according to research firm TrendForce. However, the change does not indicate weaker memory demand from Nvidia. Instead, it reflects limitations in the amount of LPDRAM expected to be available to the company under preliminary 2027 production allocations from memory suppliers.

Imec awarded EUR 8 mln Spain grant for chip R&D
SPAIN 10 JUN

Imec awarded EUR 8 mln Spain grant for chip R&D

Spain's Council of Ministers has approved an EUR 8 million direct grant to the Imec Spain Foundation to support semiconductor research and development. The funding will go toward the Unico R&D-Imec Spain programme, managed by the foundation, which oversees advanced research in nanotechnology and digital technologies.

UK govt announces new GBP 1.1 billion AI Hardware Plan
UNITED KINGDOM 9 JUN

UK govt announces new GBP 1.1 billion AI Hardware Plan

The UK government has announced a new AI Hardware Plan to back UK companies developing chips/semiconductor technologies for AI. The GBP 1.1 billion plan includes GBP 750 million for a new national AI supercomputer - including GBP 400 million to buy next-generation AI chips, of which GBP 150 million which will be used to buy next-generation inference ships in summer 2026, with the government acting as early customers for UK firms/start-ups to bring new technologies to market; and GBP 250 million to buy more

GLOBAL 9 JUN

Google taps Intel to supply 3 million tensor processors in 2028 - report

Google is believed to have placed a booking with Intel supply over 3 million of its custom-designed tensor processing microchips (TPUs), designed to accelerate matrix AI calculations in its data centres and Pixel smartphones. While an official confirmation is still to emerge, California-based technology journal The Information cited unnamed sources with a direct understanding of ongoing deal discussions. The report indicated Intel would begin shipping commercial volumes to Google sometime in 2028.

KOREA, REPUBLIC OF 8 JUN

Naver and Nvidia agree partnership for large-scale AI infrastructure projects

South Korean internet giant Naver has entered into a partnership with Nvidia to develop large-scale AI infrastructure projects, including plans for gigawatt-scale AI data centre capacity targeting markets across Asia-Pacific, Europe and the Middle East. The companies said the agreement extends beyond technology cooperation to include collaboration across project development, customer acquisition and capital investment, with Naver participating as a strategic partner sharing both project risks and returns.

KOREA, REPUBLIC OF 8 JUN

Nvidia and SK Hynix sign multiyear partnership for next-gen AI memory

Nvidia and SK Hynix have announced a multiyear technology partnership to develop next-generation memory technologies for AI infrastructure and expand collaboration on semiconductor design and manufacturing. The agreement is intended to align SK Hynix's memory development and supply plans with NVIDIA's AI infrastructure roadmap as demand for AI computing systems continues to grow. 

KOREA, REPUBLIC OF 8 JUN

SKT plans AI cloud deployment with Nvidia, targeting first facility in 2027

SK Telecom (SKT) and Nvidia have announced plans to develop a large-scale AI cloud platform in South Korea, with the first AI facility scheduled to become operational in 2027. The project will use Nvidia's DSX AI infrastructure architecture and is intended to support AI training, inference and agentic AI workloads for enterprises and industries in South Korea. The platform will support sovereign AI, enterprise AI and physical AI applications, with potential expansion into other Asian markets.

GLOBAL 4 JUN

Oracle Cloud joins Arm's AGI CPU ecosystem

Oracle Cloud Infrastructure (OCI) has become the latest partner enrolled in an Arm CPU platform targeting artificial intelligence infrastructure and agentic AI workloads. Announced at Computex 2026, the move sees OCI introduced to Arm's AGI CPU ecosystem, with Arm's processors designed to double the per rack performance of traditional x86 chips when deployed in the data centre. OCI's involvement was one of several highlights talked about at this year's Computex. Other developments include the launch of new

GLOBAL 4 JUN

Intel, Foxconn unveil AI infrastructure partnership

Foxconn and Intel plan to join forces to deploy silicon, networking and server equipment tailored to AI data centres and intelligent compute workloads executed from the network edge. The partnership between two global hardware heavyweights pairs Intel's silicon and software with Foxconn's manufacturing and deployment footprint. Foxconn said the collaboration would explore comprehensive AI data centre applications, bringing together silicon, rack, system and application-layer components. The partnership also

GLOBAL 4 JUN

Broadcom Q2 semiconductor revenue from AI climbs 143% with more growth to come

Broadcom CEO Hock Tan said the company achieved record revenue, operating profit and free cash flow in its second fiscal quarter to 03 May, driven by accelerating growth in AI semiconductor turnover and strong operating leverage. Its Q2 semiconductor income from AI climbed by 143 percent year on year to USD 10.8 billion, driven by rising demand for custom AI accelerators and AI networking. It expects the momentum to continue and in Q3, it foresees semiconductor revenue from AI expanding by more than 200 per

UNITED STATES 4 JUN

Qualcomm AI tech powers Project 91 car at Nascar San Diego

Qualcomm Technologies has partnered with Trackhouse Racing on the Project 91 entry into the inaugural Nascar San Diego Cup Series Race. Kevin Magnussen, former F1 and current FIA World Endurance Championship (WEC) driver, will drive the No 91 Qualcomm Chevrolet in the race on 21 June at Naval Base Coronado in San Diego. Qualcomm is the Official Circuit Partner of Nascar San Diego race weekend. 

EUROPE 3 JUN

European Technological Sovereignty Package sets out plans for chips, AI, open source and energy digitisation

The European Commission has presented the European Technological Sovereignty Package of measures to strengthen capacity in semiconductors, artificial intelligence (AI), cloud services and open source. The package includes two legislative proposals, namely the Chips Act 2.0 and the Cloud and AI Development Act. It also sets out the Open Source Strategy and the Strategic Roadmap for Digitisation and AI in Energy.

GLOBAL 2 JUN

STMicroelectronics raises FY sales forecast for data centre products on strong AI demand

STMicroelectronics said it anticipates higher FY revenues in its data centre product lines in light of surging AI infrastructure demand and improved supply chain visibility. The firm now anticipates data centre revenues in 2026 will arrive at about USD 1 billion, up from above USD 500 million previously predicted. ST's projection for data centres in FY27 has been lifted accordingly, with revenues now expected to increase twofold to approximately USD 2 billion next year. The company is scheduled to publish i

UNITED STATES 1 JUN

Morse Micro debuts HaLoW module powered by second-generation RF chip

Wi-Fi HaLow silicon specialist Morse Micro is preparing to launch its latest connectivity module based on its latest generation RF chip technology. Set initially for distribution to US and Canadian product teams, the MM8108-M2 is a high-powered module built on Morse Micro's second-generation MM8101 system on a chip. The SoC is coupled with an external power amplifier that transmits at up to 28.5 dBm output power, and a surface acoustic wave (SAW) tuned for 902-928 MHz ISM frequencies as allocated in North A

GLOBAL 1 JUN

Nvidia Vera Rubin enters full production as AI factory platform takes shape

Nvidia has announced that its Vera Rubin platform is now ramping into full production, with the company positioning the system as a comprehensive end-to-end AI factory platform for cloud providers, hyperscalers and telecoms operators. Designed as a pod-scale system of five purpose-built racks operating as a single AI supercomputer, Vera Rubin claims ten times the agent throughput of the previous Grace Blackwell generation. 

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