Naver and Nvidia agree partnership for large-scale AI infrastructure projects
KOREA, REPUBLIC OF 8 JUN

Naver and Nvidia agree partnership for large-scale AI infrastructure projects

South Korean internet giant Naver has entered into a partnership with Nvidia to develop large-scale AI infrastructure projects, including plans for gigawatt-scale AI data centre capacity targeting markets across Asia-Pacific, Europe and the Middle East. The companies said the agreement extends beyond technology cooperation to include collaboration across project development, customer acquisition and capital investment, with Naver participating as a strategic partner sharing both project risks and returns.

Nvidia and SK Hynix sign multiyear partnership for next-gen AI memory
KOREA, REPUBLIC OF 8 JUN

Nvidia and SK Hynix sign multiyear partnership for next-gen AI memory

Nvidia and SK Hynix have announced a multiyear technology partnership to develop next-generation memory technologies for AI infrastructure and expand collaboration on semiconductor design and manufacturing. The agreement is intended to align SK Hynix's memory development and supply plans with NVIDIA's AI infrastructure roadmap as demand for AI computing systems continues to grow. 

SKT plans AI cloud deployment with Nvidia, targeting first facility in 2027
KOREA, REPUBLIC OF 8 JUN

SKT plans AI cloud deployment with Nvidia, targeting first facility in 2027

SK Telecom (SKT) and Nvidia have announced plans to develop a large-scale AI cloud platform in South Korea, with the first AI facility scheduled to become operational in 2027. The project will use Nvidia's DSX AI infrastructure architecture and is intended to support AI training, inference and agentic AI workloads for enterprises and industries in South Korea. The platform will support sovereign AI, enterprise AI and physical AI applications, with potential expansion into other Asian markets.

Oracle Cloud joins Arm's AGI CPU ecosystem
GLOBAL 4 JUN

Oracle Cloud joins Arm's AGI CPU ecosystem

Oracle Cloud Infrastructure (OCI) has become the latest partner enrolled in an Arm CPU platform targeting artificial intelligence infrastructure and agentic AI workloads. Announced at Computex 2026, the move sees OCI introduced to Arm's AGI CPU ecosystem, with Arm's processors designed to double the per rack performance of traditional x86 chips when deployed in the data centre. OCI's involvement was one of several highlights talked about at this year's Computex. Other developments include the launch of new

Intel, Foxconn unveil AI infrastructure partnership
GLOBAL 4 JUN

Intel, Foxconn unveil AI infrastructure partnership

Foxconn and Intel plan to join forces to deploy silicon, networking and server equipment tailored to AI data centres and intelligent compute workloads executed from the network edge. The partnership between two global hardware heavyweights pairs Intel's silicon and software with Foxconn's manufacturing and deployment footprint. Foxconn said the collaboration would explore comprehensive AI data centre applications, bringing together silicon, rack, system and application-layer components. The partnership also

Broadcom Q2 semiconductor revenue from AI climbs 143% with more growth to come
GLOBAL 4 JUN

Broadcom Q2 semiconductor revenue from AI climbs 143% with more growth to come

Broadcom CEO Hock Tan said the company achieved record revenue, operating profit and free cash flow in its second fiscal quarter to 03 May, driven by accelerating growth in AI semiconductor turnover and strong operating leverage. Its Q2 semiconductor income from AI climbed by 143 percent year on year to USD 10.8 billion, driven by rising demand for custom AI accelerators and AI networking. It expects the momentum to continue and in Q3, it foresees semiconductor revenue from AI expanding by more than 200 per

Qualcomm AI tech powers Project 91 car at Nascar San Diego
UNITED STATES 4 JUN

Qualcomm AI tech powers Project 91 car at Nascar San Diego

Qualcomm Technologies has partnered with Trackhouse Racing on the Project 91 entry into the inaugural Nascar San Diego Cup Series Race. Kevin Magnussen, former F1 and current FIA World Endurance Championship (WEC) driver, will drive the No 91 Qualcomm Chevrolet in the race on 21 June at Naval Base Coronado in San Diego. Qualcomm is the Official Circuit Partner of Nascar San Diego race weekend. 

European Technological Sovereignty Package sets out plans for chips, AI, open source and energy digitisation
EUROPE 3 JUN

European Technological Sovereignty Package sets out plans for chips, AI, open source and energy digitisation

The European Commission has presented the European Technological Sovereignty Package of measures to strengthen capacity in semiconductors, artificial intelligence (AI), cloud services and open source. The package includes two legislative proposals, namely the Chips Act 2.0 and the Cloud and AI Development Act. It also sets out the Open Source Strategy and the Strategic Roadmap for Digitisation and AI in Energy.

STMicroelectronics raises FY sales forecast for data centre products on strong AI demand
GLOBAL 2 JUN

STMicroelectronics raises FY sales forecast for data centre products on strong AI demand

STMicroelectronics said it anticipates higher FY revenues in its data centre product lines in light of surging AI infrastructure demand and improved supply chain visibility. The firm now anticipates data centre revenues in 2026 will arrive at about USD 1 billion, up from above USD 500 million previously predicted. ST's projection for data centres in FY27 has been lifted accordingly, with revenues now expected to increase twofold to approximately USD 2 billion next year. The company is scheduled to publish i

Morse Micro debuts HaLoW module powered by second-generation RF chip
UNITED STATES 1 JUN

Morse Micro debuts HaLoW module powered by second-generation RF chip

Wi-Fi HaLow silicon specialist Morse Micro is preparing to launch its latest connectivity module based on its latest generation RF chip technology. Set initially for distribution to US and Canadian product teams, the MM8108-M2 is a high-powered module built on Morse Micro's second-generation MM8101 system on a chip. The SoC is coupled with an external power amplifier that transmits at up to 28.5 dBm output power, and a surface acoustic wave (SAW) tuned for 902-928 MHz ISM frequencies as allocated in North A

Nvidia Vera Rubin enters full production as AI factory platform takes shape
GLOBAL 1 JUN

Nvidia Vera Rubin enters full production as AI factory platform takes shape

Nvidia has announced that its Vera Rubin platform is now ramping into full production, with the company positioning the system as a comprehensive end-to-end AI factory platform for cloud providers, hyperscalers and telecoms operators. Designed as a pod-scale system of five purpose-built racks operating as a single AI supercomputer, Vera Rubin claims ten times the agent throughput of the previous Grace Blackwell generation. 

Nvidia and Microsoft bring frontier AI compute to Windows
GLOBAL 1 JUN

Nvidia and Microsoft bring frontier AI compute to Windows

Nvidia has announced two products developed with Microsoft that bring what the two describe as data-centre-class AI capabilities to the Windows desktop for the first time, targeting enterprise developers, data scientists and engineers who currently rely on cloud infrastructure for large model workloads. The flagship product, Nvidia DGX Station for Windows, is a "deskside system" built on the GB300 Grace Blackwell Ultra Desktop Superchip capable of running models up to one trillion parameters locally. 

GLOBAL 29 MEI

Qualcomm brings laptop line-up to budget models with Snapdragon C chipset

Qualcomm is launching an entry-tier laptop computer processor, the Snapdragon C Platform, building on its push into the personal computing space as part of a wider diversification beyond smartphones. Snapdragon C is designed to produce all-day battery life with responsive user feedback in entry-level laptops typically retailing for at least USD 300. It is debuting in an initial cohort of products from OEM partners, including Acer, HP, and Lenovo, with initial retail sell-in anticipated before end-2026.

GLOBAL 29 MEI

Mediatek set for Computex showcase starring Wi-Fi 8, 6G and edge computing

Mediatek will spotlight its Wi-Fi 8 silicon technology at Computex 2026. The showcase centres on Mediatek's back-compatible Wi-Fi 8 chipset, the Filogic 8800, designed to unlock next-generation performance while also boosting wireless link stability in older Wi-Fi specifications. At peak output, the chip is expected to increase system throughput by about 200 percent and enables file downloads up to 50 percent faster. Filogic 8800 includes a smart Wi-Fi toolkit with optimisation features such as AI Network D

GLOBAL 29 MEI

Anthropic nears USD 1 trillion valuation in latest funding round

Anthropic announced it has raised USD 65 billion in Series H funding to support the further growth and development of its AI business. The round led by Altimeter Capital, Dragoneer, Greenoaks and Sequoia Capital valued the company at USD 965 billion, again more than doubling its valuation from the previous investment round in February.  

GLOBAL 29 MEI

Samsung ships first HBM4E samples

Samsung Electronics has begun shipping what it describes as the industry's first 12-layer HBM4E memory samples to major global customers, extending its next-generation high-bandwidth memory roadmap amid rapidly rising demand for AI infrastructure. The company said the new HBM4E product builds on its earlier commercialisation of HBM4 and is designed to support increasingly demanding AI workloads, including large language models and hyperscale computing systems.

GLOBAL 29 MEI

Agentic AI to push global memory market past USD 1.28 tn by 2027 - TrendForce

Market analyst TrendForce has sharply raised its forecasts for the global memory industry, arguing that the rise of inference-heavy Agentic AI workloads is creating a structural surge in demand for DRAM and NAND flash that could push the market beyond USD 1.28 trillion by 2027. It said the AI industry's transition from large-scale model training toward inference-centric autonomous AI agents is fundamentally changing memory consumption patterns. 

GLOBAL 29 MEI

Arm open-sources AI security framework for software vulnerability detection

Arm has open-sourced an AI-based security analysis framework designed to improve the detection of software vulnerabilities across large-scale codebases. The framework, called Metis, has been developed by Arm's product security team and is currently being used internally across more than 130 software projects, with wider deployment planned across the company by the end of 2026. Metis is designed to identify complex security vulnerabilities that may span multiple software components, systems or layers and whi

GLOBAL 28 MEI

IQE closes strategic funds to pay off debt as FY sales trend lower

Chip wafer supplier IQE has tied up an GBP 81 million strategic fundraising announced in April to pay off debt obligations. The transaction raised GBP 45 million from equity and non-interest bearing convertible notes, issued to strategic investor Macom Technology Solutions. The remaining funds were sourced through a GBP 23 million redemption and reinvestment of existing convertibles, and through a GBP 13 million placing and retail offer. Net proceeds from the fundraising should reach GBP 27.9 million, follo

GLOBAL 28 MEI

Broadcom joins Samsung to launch Wi-Fi 8 FWA silicon archetype

Broadcom has partnered with Samsung to introduce a fixed wireless access (FWA) reference architecture pairing its Wi-Fi 8 system-on-chip with Samsung's B1320 5G modem. The collaboration aims to catalyse a benchmark for FWA services optimised for the emerging Wi-Fi 8 standard and the 3GPP's Release 17 specification. Broadcom expects this approach to facilitate service differentiation as mobile operators strive to expand fibre-grade FWA offerings, delivering a viable pathway to mass-market scalability and cos

GLOBAL 28 MEI

GCT boosts 5G silicon roadmap with MaxLinear AnyWAN collaboration

GCT Semiconductor has teamed up with MaxLinear to deliver a presentation at Computex on integrated fixed wireless access (FWA) and multi-WAN gateways. The showcase reflects a newly announced strategic partnership between the companies that looks set to further GCT's 5G silicon ramp-up. The partners have pooled resources to introduce a pre-integrated technology solution coupling MaxLinear's Wi-Fi AnyWAN system-on-chip with GCT's cellular modem.

GLOBAL 28 MEI

Marvell Technology improves sales outlook for next 2 years on data centre networking demand

Marvell Technology announced a big increase in its expected sales in fiscal 2027 and 2028 alongside its Q127 figures, thanks to strong demand for its data centre networking products. The company's revenues for the three months to April rose 28 percent year-on-year to USD 2.418 billion and it forecast 35 percent growth in fiscal Q2. Marvell said growth is expected to accelerate each quarter this year and reach around 40 percent for the full year. 

GLOBAL 27 MEI

MaxLinear and Edgecore collaborate on edge intelligence connectivity

MaxLinear and Edgecore Networks have reached a strategic agreement to market an integrated networking solution that executes AI compute closer to the source of data generation in enterprise networks. The co-operation pairs MaxLinear's connectivity platforms and Edgecore's open networking products with a focus on AI-infused workloads. MaxLinear's contribution is based on its multi-interface WAN silicon platform that harmonises XGS-PON, Ethernet, and Wi-Fi access, facilitating sustained 10 Gbps data throughpu

GLOBAL 27 MEI

Semtech restores profitability in Q1 with sales up 16%

Semtech posted a USD 26.6 million net profit in the fiscal first quarter to end-April, reversing a USD 29.8 million loss in the final quarter of FY26 that was attributed to goodwill writedowns. Group sales of USD 291 million arrived ahead of Semtech's prior USD 278-288 million target, and were up by around 16 percent year-on-year, amid growth in all of the vendor's operating units. Signal integrity silicon sales lifted 39 percent to USD 102 million, while analogue mixed signal and wireless chips grew 11.3 p

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