InterDigital and Sony launch Convida Wireless joint venture

News Wireless United States 4 JAN 2013
InterDigital and Sony launch Convida Wireless joint venture
InterDigital and Sony have announced the launch of a joint venture to combine Sony's consumer electronics expertise with InterDigital's wireless machine-to-machine (M2M) and bandwidth management research. The joint venture, Convida Wireless, will focus on driving new research in the growing field of M2M wireless communications and other connectivity areas. Based on the terms of the agreement, the parties will contribute funding and resources for additional M2M research and platform development, which will be carried out by InterDigital Solutions. Stephens Capital Partners will be a minority investor in Convida Wireless. The agreement also includes a patent licence from InterDigital for Sony's 3G and 4G products.

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