Sony has announced plans to raise JPY 440 billion from the issue of shares and convertible bonds in order to invest in its mid-term strategy and especially its devices business. The offering will include up to 87.2 million common shares for Japanese and international investors, to be priced later in July at up to 10 percent less than the most recent closing share price, and JPY 120 billion in zero-coupon convertible bonds due in September 2022.
Sony said it expects net proceeds of JPY 321 billion from the share issue, assuming the over-allotment is exercised, based on its closing share price of 24 June of JPY 3,820 plus a small discount. The bond issue should raise JPY 119 billion after underwriting costs.
From the share sale proceeds, it plans to use JPY 188 billion for capital expenditure at its Devices division, and the remainder for R&D at Devices. In particular, it will focus on increasing production capacity and R&D in stacked CMOS image sensors, used in its own and other manufacturers' phones and cameras. Another JPY 51 billion from the bond issue will go to Devices capex, JPY 25 billion to redeem corporate bonds coming due and the remainder to pay off later debt.
