Intel lets go of head chip executive, reorganises division

Nieuws Algemeen Wereld 28 JUL 2020
Intel lets go of head chip executive, reorganises division

Intel is shaking up its tech organisation and executive team, with the goal of pushing the company’s product leadership and improving its focus and accountability. With the changes, executive Murthy Renduchintala will be leaving the company. Although Intel did not give a specific reason for the move, Renduchintala’s departure comes in the wake of a delay in the launch of Intel’s next-gen 7nm chips and an expected slowdown at the company for the third quarter. Intel hired the executive from Qualcomm in February 2016, putting him in charge of chip design, engineering and manufacturing as head of TSCG.

CEO Bob Swan said that effective immediately, Intel’s Systems Architecture and Client Group (TSCG) will be separated into five teams, whose executives will report to him. 

Technology Development will be led by Ann Kelleher, previously head of Intel manufacturing. Kelleher will replace Mike Mayberry, who will help with the transition until his planned retirement at the end of the year, after 36 years at Intel. 

Manufacturing and Operations will be headed by Keyvan Esfarjani, who most recently led manufacturing for Intel’s Non-Volatile Memory Solutions Group (NSG). Esfarjani will be replacing Kelleher in his new role. 

Josh Walden will be the interim leader of Design Engineering, until a permanent executive is found. He most recently led the Intel Product Assurance and Security Group (IPAS), which will continue reporting to him. 

Raja Roduri will continue to head Architecture, Software and Graphics while Randhir Thakur will continue as leader of Supply Chain.

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