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Broadcom debuts 5nm ASIC for data centre, cloud infrastructure

Tuesday 1 December 2020 | 11:14 CET | News
Broadcom announced sampling of its 5nm ASIC for data centre and cloud infrastructure. Built on TSMC's N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, Micron's HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY (physical layer) IP using TSMC CoWoS (chip-on-wafer-on-substrate) interposer technology. In addition, Broadcom said it has multiple ASIC devices in development targeting AI, high performance computing and 5G wireless infrastructure applications.

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Categories: Fixed
Companies: Broadcom
Countries: World
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