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Wireless

Honor previews new Magic3 series with Qualcomm 888 Plus chip

Tuesday 20 July 2021 | 13:56 CET | News
Honor announced that it will use Qualcomm's Snapdragon 888 Plus chipset on its next flagship smartphone, the Magic3 series launching globally on 12 August. The 5G and A1 capabilities of the chip are expected to deliver an enhanced performance, especially for the camera. The company gave the first details of the phone at an event with Qualcomm CEO Cristiano Amon and Honor CEO George Zhao.

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Categories: Mobile & Wireless
Companies: Honor / Qualcomm
Countries: World
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