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General

Huawei files for bond issue in China

Thursday 12 September 2019 | 08:43 CET | News
Huawei plans to issue two tranches of bonds worth CNY 3 billion (USD 422 million) each. This will be the first time it goes to the onshore yuan bond market in China, Reuters reports. 

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Categories: General
Companies: Huawei
Countries: China / World
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