Infineon, Qualcomm to develop reference design for 3D authentication

Friday 6 March 2020 | 09:44 CET | News
Infineon said it is working with Qualcomm to develop a reference design for 3D authentication based on the Qualcomm Snapdragon 865 Mobile Platform. The move will extend Infineon's 3D sensor technology for mobile devices. Infineon said the reference design uses the REAL3 3D Time-of-Flight (ToF) sensor and will enable a standardised, cost-effective and easy-to-design integration for smartphone manufacturers. The company believes 3D sensors will enable new applications such as secured authentication or payment by facial recognition.

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Categories: IT / Mobile & Wireless
Companies: Infineon / Qualcomm
Countries: World
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