0
Wireless

Intel partners DARPA to design custom chips with security countermeasures

Thursday 18 March 2021 | 13:50 CET | News
Intel has inked a three-year partnership with the US Defense Advanced Research Projects Agency (DARPA) to advance the development of domestically manufactured structured Application Specific Integrated Circuit (ASIC) platforms. The aim is to design custom chips with strong security technologies, made in the US, under a Structured Array Hardware for Automatically Realized Applications (Sahara) partnership. Intel said it is combining its eASIC structured ASIC technology with interface chiplets so that defense but also commercial electronics systems developers can rapidly develop and deploy

Thank you for visiting Telecompaper

Sign up below to get access to the rest of this article and all the telecom news you need.

  • Register free and gain access to even more articles from Telecompaper. Register here
  • Subscribe and get unlimited access to Telecompaper’s full coverage, with a customised choice of news, commentary, research and alerts.

Subscriptions

Already registered?



Categories: Mobile & Wireless
Companies: Intel
Countries: United States
::: add a comment

Add comment

Please login or register to leave a comment.

We welcome comments that add value to the discussion. We attempt to block comments that use offensive language or appear to be spam, and our editors frequently review the comments to ensure they are appropriate. If you see a comment that you believe is inappropriate to the discussion, you can bring it to our attention by using the report abuse links. As the comments are written and submitted by visitors of the Telecompaper website, they in no way represent the opinion of Telecompaper.


Related

Utah Inland Port Authority to build private LTE/5G network with QuayChain

Published 18 Aug 2021 16:31 CET | United States
The Utah Inland Port Authority (UIPA) has entered a partnership with QuayChain Technologies to build and operate a private LTE/5G ...

Intel to upgrade chip manufacturing plant in New Mexico with investment of USD 3.5 billion

Published 03 May 2021 09:28 CET | United States
Intel will spend USD 3.5 billion on the upgrade of its chip manufacturing plant in New Mexico's Rio Rancho, CEO Pat Gelsinger ...

Intel to expand Irish manufacturing operations, creating 1,600 new jobs

Published 24 Mar 2021 10:46 CET | Ireland
Intel plans to expand its semiconductor manufacturing operations in Ireland, creating 1,600 new high-tech jobs. The company ...

Darpa, Linux Foundation create open software initiative to accelerate US 5G stack

Published 18 Feb 2021 11:50 CET | United States
The Linux Foundation said it entered a collaboration agreement with the Defense Advanced Research Projects Agency (Darpa) to ...

Intel revenues, profit exceed expectations in Q4

Published 22 Jan 2021 10:13 CET | World | Update: 22 Jan 2021 10:25 CET
Intel reported stronger-than-expected results for the fourth quarter and a record cash from operations, and said it will upping ...

Intel intros eASIC N5X as low-power alternative to FPGA

Published 18 Nov 2020 08:57 CET | World
Intel announced a new, customizable ASIC designed to help accelerate application performance across 5G, artificial intelligence, ...

Intel unveils new chip for 5G base stations, expands Xeon Scalable range

Published 24 Feb 2020 15:52 CET | World
Intel is maintaining its commitment to the mobile network market with the launch of a processor for 5G base stations. The company ...

ZTE picks Intel's eASIC devices for 5G wireless deployment

Published 02 May 2019 09:52 CET | World
ZTE selected Intel eASIC devices for its 5G wireless products, an action which enables it to meet the critical cost and power ...