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Wireless

Intel unveils dime-sized hybrid chip aimed at small form devices

Thursday 11 June 2020 | 09:52 CET | News
Intel has announced a new hybrid chip aimed at small form factors, across all single, dual and foldable-screen devices such as laptops, tablets and foldables. The chips, Intel Core processors with Intel Hybrid Technology or "Lakefield" for short, use Foveros 3D packaging for a compact form and sport hybrid CPU architecture in the core for power and performance scalability, Intel said. The chips are the smallest so far at Intel that deliver Intel Core performance and full Windows compatibility. 

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Categories: Mobile & Wireless
Companies: Intel / Lenovo / Neo / Qualcomm / Samsung
Countries: World
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