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MediaTek to unveil updated versions of Dimensity 700, 800 5G chips in H1 - report

Monday 25 January 2021 | 09:35 CET | News
Taiwanese semiconductor firm MediaTek is expected to bring out the upgraded versions of its Dimensity 700 chips in the second quarter, and the upgraded versions of its Dimensity 800 chips at Mobile World Congress 2021, scheduled for the moment for 28 June to 1 July, Digitimes reported, citing industry sources.

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Categories: Mobile & Wireless
Companies: MediaTek
Countries: World
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