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Qualcomm and Himax to jointly develop 3D depth sensing camera

Wednesday 30 August 2017 | 14:20 CET | News
Qualcomm and Himax have announced a collaboration to accelerate the development and commercialisation of a high resolution, low power active 3D depth sensing camera system for applications including biometric face authentication, 3D reconstruction and scene perception for mobile, IoT, surveillance, automotive and AR/VR technologies. In a joint statement the companies said the partnership brings together Qualcomm Spectra expertise in computer vision architecture and algorithms with Himax's complementary technologies in wafer optics, sensing, driver and module integration capabilities to

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Categories: Mobile & Wireless
Companies: Qualcomm
Countries: World
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