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Ranovus collaborates with IBM, TE Connectivity, Senko on Co-Packaged Optics apps in data centre

Friday 13 March 2020 | 11:04 CET | News
Ranovus announced a strategic collaboration with IBM, TE Connectivity and Senko Advanced Components to create an ecosystem to design and manufacture multi-vendor products for Co-Packaged Optics applications in data centre. The collaboration leverages Ranovus' highly scalable Odin silicon photonics engine announced earlier; IBM's fiber V-groove interconnect packaging technology; TE's co-packaged (CP) fine pitch socket interposer technology, as well as Senko's fibre optic connectivity products.

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Categories: Fixed / IT
Companies: Ranovus / TE Connectivity
Countries: World
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