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Wireless

Samsung ramps up 10nm production, plans 8nm, 6nm

Thursday 16 March 2017 | 10:57 CET | News
Samsung Electronics announced it's ramping up is 10nm FinFET process technology to manufacture the next-generation of smartphone chips. The company has shipped more than 70,000 silicon wafers of its first-generation 10nm LPE (Low Power Early) to date. The mass production of 10LPE first started last October. Following the 10LPE version, the 10nm LPP and LPU will enter mass production by the end of the year and next year, respectively. Samsung Electronics has also announced the addition of the 8nm and the 6nm process technologies to its current process roadmap.

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Categories: Mobile & Wireless
Companies: Samsung
Countries: World
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