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General

SoftBank plans JPY 400 bln bond issue

Tuesday 4 June 2013 | 01:40 CET | News
Japanese communications provider SoftBank plans to issue JPY 400 billion in unsecured, straight bonds to help finance the Sprint Nextel take-over and to partly repay existing loans. The term for the bonds is set at five years and the coupon rate at 1.74 percent.

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Categories: General
Companies: Softbank
Countries: Japan
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