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General

Telefonica Chile places CLP 48 bln in bonds

Friday 20 January 2017 | 09:29 CET | News
Telefonica Chile has placed CLP 48 billion (around USD 73 million) in bonds on the local market, reports business daily Expansion. The bonds have a 4.55 percent placement interest rate and mature in six and a half years. Telefonica Chile said the proceeds will be allocated entirely to refinancing liabilities of the company and its subsidiaries. The latest bond issue comes after Telefonica Chile placed CLP 94.4 billion on the local market via bullet bonds in September last year.

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Categories: General
Companies: Telefonica Chile
Countries: Chile
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