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General

Telefonica Chile places CLP 94 bln in bonds

Thursday 29 September 2016 | 10:57 CET | News
Telefonica Chile has placed CLP 94.4 billion (around USD 140 million) on the local market via bullet bonds maturing in September 2021. In a statement to stock market regulator SVS, Telefonica said the bonds have a 4.75 percent placement interest rate and were 2.45 times oversubscribed.

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Categories: General
Companies: Telefonica Chile
Countries: Chile
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