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General

Telefonica issues EUR 2 bln bond to raise debt

Tuesday 11 October 2016 | 08:26 CET | News
Telefonica has announced the issue of EUR 2 bln in notes via Telefonica Emisiones in its first attempt to raise debt following the shelved initial public offering of its infrastructure unit Telxius last month. In a statement to Spanish market regulator CNMV, the company said it would issue notes for EUR 1.25 billion due in 2020 at 0.318 percent coupon at par value and notes for EUR 750 million due in 2031 at 1.930 percent. A Reuters source indicated that the company was issuing senior debt in line with its regular funding plans, and wanted to time the transaction ahead of potential volatility

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Categories: General
Companies: O2 UK / Telefonica / Telxius
Countries: Spain / World
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