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General

Telefonica issues USD 2 bln in 20- and 30-year bonds

Wednesday 28 February 2018 | 11:46 CET | News
Telefonica has announced the issue of a total of USD 2 billion in 20 and 30-year bonds as part of its US Debt Registered Programme. In a statement to Spanish market regulator CNMV, Telefonica said the issue was split into two tranches. The first tranche, amounting to USD 750 million, is due on 06 March 2038, with a coupon of 4.665 percent, with the second tranche, amounting to USD 1.25 billion, is due on 08 March 2048, with a coupon of 4.895 percent.

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Categories: General
Companies: Telefonica
Countries: Spain / World
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