Samsung launches 10-nano process for system LSI chips

News Wireless Global 19 OKT 2016
Samsung launches 10-nano process for system LSI chips

Samsung Electronics has introduced a 10-nano process for the mass-production of system large-scale integration (LSI) semiconductor chips. The 10-nano semiconductor products will be introduced on devices scheduled for launch in early 2017, The Korea Times reports, citing a company statement. “Starting from the mass-production in the first-generation of 10-nano process (10LPE), we are developing the second-generation process (10LPP) for commercial use by 2017", said a Samsung representative. "Even after the second-generation process, we plan to use the 10-nano process for a long time through continuous improvements", he added.

"Considering the overall trends, the 10-nano is the most effective process with the best commercial viability for now", said Samsung Electronics System LSI Marketing VP Ben Hur at a conference call earlier in July. "We are ready to release the prototype of 7-nano product anytime. But what matters is when to commercialize it", he added.

To expand its presence in the foundry business, Samsung said it is currently working with its clients and partners to verify the design tool for 10-nano process and providing them with design kits.

Samsung has also recently expanded the application of its 14-nano process technology to the manufacturing of its Exynos AP for wearable devices. It has already applied the 14-nano process both premium and middle-class mobile device APs since early this year. "The new product suggests a new paradigm of wearable system-on-a-chip based on low power technology, integrated modem and connectivity as well as innovative packaging technology", Hur said. "This will dramatically extend use time of devices and realize slimmer designs, contributing to the advancement of wearable devices", he added.

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