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General

Telefonica issues first USD bonds since crisis

Thursday 2 March 2017 | 09:18 CET | News
Telefonica has announced the issue of a total of USD 3.5 billion in notes in what is its first attempt to raise debt in the US market since before the financial crisis of 2008. In a statement to Spanish market regulator CNMV, Telefonica said the issue under its US Debt Registered Programme was split into two tranches. The first tranche, amounting to USD 1.5 billion, is due on 08 March 2027, with a coupon of 4.103 percent, with the second tranche, amounting to USD 2 billion, is due on 08 March 2047, with a coupon of 5.213 percent. No Spanish company has managed to issue debt in the US market

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Categories: General
Companies: Telefonica / Telxius
Countries: Spain / World
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