Qualcomm has presented new chips to bring 5G services to a wider market in 2020. The flagship Snapdragon 865 Mobile Platform, which includes the Snapdragon X55 Modem-RF System, and the Snapdragon 765/765G with integrated 5G connectivity and AI processing were presented at the company's annual Snapdragon Tech Summit and are expected to launch in Android smartphones in the coming months.
Customers who plan to use the new chips include Motorola in its 5G phones next year, Xiaomi with the Snapdragon 865 on the Mi 10 in Q1 2020 and the 765G in the Redmi K30 series launching in a week, Oppo with a new flagship in Q1 running the 865 and the 765G in the Reno3 Pro launching this month, and HMD Global with the Snapdragon 765. G version of the 765 offers an enhanced gaming experience.
The Snapdragon 865 for flagship smartphones comes with the X55 modem for 5G speeds up to 7.5 Gbps, as well as the fifth-generation Qualcomm AI Engine and new Qualcomm Sensing Hub for more intelligence and personalization. It includes the Qualcomm Spectra 480 Image Signal Processor for speeds of up to 2 gigapixels per second and the new Qualcomm Snapdragon Elite Gaming features for desktop-quality gaming and realistic graphics. The Qualcomm Kryo 585 CPU delivers up to 25 percent performance improvement, the company said, and the new Qualcomm Adreno 650 GPU offers up to 25 percent overall performance boost compared to the previous generations.
The Snapdragon 765 comes with the X52 5G modem for speeds up to 3.7 Gbps as well as the new AI Engine, Kryo 475 CPU and Adreno 620 GPU. The G version of 765 also includes Qualcomm Snapdragon Elite Gaming, offering up to 5.5 TOPS of AI performance and 10 percent faster graphics rendering with a bolstered Adreno GPU. Special game extensions and optimizations, smoother gameplay and more enhanced detail and colours are also part of the G model.
Qualcomm also introduced its first family of mobile platform-based modules, the Snapdragon 865 and 765 Modular Platforms. These are designed to help the industry scale 5G, with lower development costs and a quick commercialisation of products and new industrial designs for mobile and IoT devices. The first carriers announcing support of the certification program for Snapdragon Modular Platforms are Verizon and Vodafone, with more expected in 2020.
In addition, Qualcomm presented 3D Sonic Max, the latest version of its ultrasonic fingerprint sensor. 3D Sonic Max offers a recognition area 17x larger than the previous generation, increased security via simultaneous two-finger authentication, and increased speed and ease of use, the company said.
